Job description
As a member of the EMM-based team, he/she is tasked with wafer level and package level IC test program development, IC characterization and qualification testing in the BU Automotive.
Note: this role does not offer any remote work possibility
Key responsibilities include, but are not limited to:
- Generation of full wafer level and package level IC test programs for evaluation and production
- Definition of IC test method and strategy.
- Structured and organized approach to developing and verifying IC functions and specifications
- Technical interface with EM design teams (local and remote)
- Product engineering for assigned ICs
- Support the BU technical leader in product test definition including technical analysis and test strategy
- Interface with Quality, Design Services, Fab, Back-End
- Interface with external customers when needed
Profile
For this role, the following profile is requested:
- Experience in all key aspects of digital and mixed signal IC test development at wafer and package levels, from test architecture definition to release to production testing
- Solid background in test concepts for high volume automotive products
- Experience in test hardware development and production tester functionality/operation.
- C (or C++) and script programming skills for test systems
- Strong motivation towards satisfying external customer requirements for automotive products
Professional requirements
- MS-level academic background, 5+ years of experience in relevant fields
- Ability to communicate with clarity and precision when interacting with internal and external groups
- Experience with Eagle ETS tester platforms
- Prior experience in automotive IC products a plus
Languages
- English at C-level is required (orally and in writing), fluency in French a strong plus