Principal RFIC Design Leader

Location : Switzerland (Neuchatel), Rue des Sors 3, 2074, Marin-Epagnier
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Job description

As the Principal level RF IC Design Leader with proven industrial experience, you will direct the development of RF intellectual property (IP) with a team of internal and external RF design engineers. You are expected to define and realize the RF architecture and circuits for our future low-power battery and battery-free products. Your main responsibilities will include:

  • Define the state-of-the-art RF IP architecture and circuits for our next generation low-power IoT platform from conception and design through test and production.
  • Lead a team in the design, layout, and test of the RF IP towards a successful product implementation, qualification, and production launch.
  • Integrate the RF IP within a larger SOC, package and PCB while mitigating coupling and emissions issues.
  • Provide RF expertise within a team environment of other designers, test engineers, and a project manager.
  • Debug complex technical problems related to the radio section of the SoCs (interfaces, digital system, power management unit, packaging, etc.).
  • Recruit and direct internal and external team members to meet target specifications and tape-out deadlines.
  • Benchmark competitive solutions and IPs, study technology and standard trends, contribute to the BU’s wireless roadmap.


Background requirements:

  • At least a Master’s degree in Electrical Engineering with specialization in RFIC design (PhD preferred)
  • At least 15 years of experience in the field of CMOS RF SoCs design, including experience in more advanced IoT process nodes such as 22nm, and circuit implementations below 1V.
  • Proven experience of putting low-power RF transceivers into high-volume production.

Professional requirements

Excellent understanding and experience expected in the following areas:

  • RF IP requirements, including RF system analysis and block specification along the signal path.
  • Design of RF/analog/mixed-signal blocks in deep-submicron CMOS: LNAs, PAs, mixers, PLLs, VCOs and crystal oscillators, data converters, and filters.
  • Use of state-of-the-art RF IC design/simulation tools and methodologies, and RF measurement instruments/analyzers.
  • Industrialization, qualification (for production) and certification of RF IP and IC solutions.

The following personal skills are expected:

  • Strong on communication and reporting in English. At ease with mentoring other teams/groups (FAE, SW, sales) and for interfacing with customers.
  • Enthusiasm and talent for solving complex problems over a variety of domains around the radio.
  • Team player sharing tasks and know-how proactively with colleagues, team driver stimulating cooperation among multidisciplinary teams/sites/partners.


  • Fluent in oral/written English is a must.
  • Other languages (especially French or German) a plus.