EM produces customer specific cost optimized and miniaturized electronic subsystems (electronic modules), for a diverse range of applications including, but not limited to:
- Telecom modules
- RFID modules
- LCD modules
- Optical modules
- Avionic modules
From a product idea, EM together with the customer will design a solution using all available and applicable technologies. EM Microelectronic has long lasting experience in with specific, highly integrated assembly techniques of electronic components and LCD displays which include:
- COB (Chip on Board)
- COG (Chip on Glass)
- COF (Chip on Flex)
- Optical feature (light guide, laser shutter, etc).
EM takes care of the design of all components, the module integration, volume production, assembly and test.