Unsawn wafer with or without Bumps
The RFID chips can be delivered as ansawn wafers. Depending on the manufacturing process of the transponder supplier we can add optional gold bumps to facilitate the assembly.
Sawn wafer with or without gold bumps
Our RFID chips can be deliverd on blue foil (sawn wafers). These wafers can optionally have gold bumps to facilitate the assembly of the transponders.
Furthermore we offer the customer the possiblity to have various wafer thicknesses.
Dual frame plastic package
Dual frame plastic package for low cost RFID applications.
Package for RFID IC's
To facilitate the fabrication of transponders and especially of ISO cards EM Microelectronic Marin Has developed a tiny package for its RFID chips. Furthermore the package alllows to fabricate more robust cards.
The CIDpack can be delivered on tape or in bags.
Small PCB with RFID chip and optional capacitor
In order to facilitate the fabrication of transponders EM MIcroelectronic Marin sells also it's RFID chips mounted on a PCB. All our RFID chips have on-chip capacitors and only a coil is needed to fabricate a transponder. Reading distance can be boosted by adding an additional capacitor.
All PCB information can be found in the respective datasheets of EM RFID products.
EM Microelectronic Marin offers also customized solutions in this area.