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Packaging & Delivery Form
ICs
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Part # |
Description |
Document |
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Unsawn Wafer |
Unsawn wafer with or without Bumps |
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Sticky Tape |
RFID chips on sticky tape to ease automated assembly |
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Sawn Wafer |
Sawn wafer with or without gold bumps |
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Packages
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Part # |
Description |
Document |
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DFN02 |
Dual frame plastic package |
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CID pack |
Package for RFID IC's |
D/231 |
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PCB |
Small PCB with RFID chip and optional capacitor |
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